Power Semiconductor Modules Copper Base Plate

Power Semiconductor Modules copper base plate

1. The Power Semiconductor Modules copper base plate is a stamping part. It is a copper sheet coil, blanking, punching, fine blanking, and piercing manufacturing process.

2. Application: Power Semiconductor Modules to Support Lower Voltages

3. Stamping material: copper

4. Surface finish: Nickel Sulfamate Plating

5. Dimensions: 62*122*3mm. In addition, the dimensions can be customized according to your requirements. If you have similar parts, please contact me. (shawn@balford.net)

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