Power Semiconductor Modules copper base plate
1. The Power Semiconductor Modules copper base plate is a stamping part. It is a copper sheet coil, blanking, punching, fine blanking, and piercing manufacturing process.
2. Application: Power Semiconductor Modules to Support Lower Voltages
3. Stamping material: copper
4. Surface finish: Nickel Sulfamate Plating
5. Dimensions: 62*122*3mm. In addition, the dimensions can be customized according to your requirements. If you have similar parts, please contact me. (firstname.lastname@example.org)